CO2 laser substrates cutting and scribing
When higher precision of dimensions is needed ELCERAM can offer CO2 micromachining using modern laser systems. Wave length of the laser beam is 10.6 µm, power up to 350 W. Typical cutting precision is ± 0.05 mm.
YAG laser ceramics marking
On request ELCERAM can offer YAG laser marking. The output power is up to 6 W, wave length 1 064 nm. The beam movement is controlled by galvanometric systems which enable to machine the ceramic parts up to dimensions of 110 mm x 110 mm.
Milling of raw ceramic products
ELCERAM can offer a production of complex ceramic parts or prototypes using raw ceramics precise milling to 0.01 mm on a CNC milling machine.
Lapping
On request ELCERAM offers ceramic parts and substrates lapping to reach higher surface quality.
|
Characteristic |
Typical values |
|
Precision of dimensions |
± 5 µm |
|
Flatness |
0.6 µm |
|
Planparallelity |
1 µm |
|
Surface roughness Ra |
0.03 µm |
Grinding
On request ELCERAM offers ceramic parts and substrates grinding using diamond planetary grinding machine. Higher precision and flatness is achieved.
|
Characteristic |
Typical values |
|
Precision of dimensions |
± 3 µm |
|
Flatness |
0.6 µm |
|
Planparallelity |
1 µm |
|
Surface roughness Ra |
0.3 µm |
|
Max dimension |
149 x 149 mm / 200 x 50 mm |
Brush substrates cleaning
Surface of the fired substrates has to be cleaned after firing. In ELCERAM this processing is done using brush cleaners where the surface is cleaned with rotating brushes and addition of abrasives. Separation powder and impurities are removed.
Blasting substrates cleaning
Substrates surface cleaning from separation powder and other impurities sticking on larger areas is made by blasting mixture of water and abrasives under high pressure.